电脉冲时效对Cu-Ni-Si合金组织和性能的影响

Effect of Electtric Pulse Current on Microstructure and Properties of Cu-Ni-Si Alloy

采用微秒级高密度脉冲电流对Cu 3.2Ni 0.75Si合金进行时效处理,系统研究了不同的电脉冲工艺对合金的显微硬度、电导率及微观组织的影响。结果表明,电脉冲可以实现Cu 3.2Ni 0.75Si合金的快速时效;并且在一定的电脉冲时效工艺下,合金形成类调幅组织,使合金的硬度有很大程度的提高;同时,合金元素沿电脉冲冲击方向的有序偏聚,使其电导率恢复,从而实现二者较理想的配合。

The milisecond high density electric pulse was used to age shortly Cu3.2Ni0.75Si copper alloy. The effects of electric pulse parameters on the microstructures, microhardness and electric conductivity of this alloy were investigated systematically. The experimental results have shown that the quick aging could be realized by electric pulse for Cu3.2Ni0.75Si copper alloy. The spnodallike decomposition occurred under proper electric pulse technology .The alloy atoms were concentrated orientedly in the direction of electric pulse current , which greatly enhance both the microhardness and electric conductivity of the alloy.