摘要
从传统的声学扫描技术在对薄芯片和多层结构检测时所表现的不足引入,主要阐述了双波透射技术在此领域应用的突出优势,介绍了双波透射技术的工作原理及其关键部件反射板的选取,以及双波透射术的应用前景。
By the analysis of the disadvantage of traditional SAM for inspecting the thin chips and multi-layer structure, the outstanding advantage of applying double through-transmission technique in this field is illustrated. The principle of the double through-transmission technique, the means of selecting the key unit-reflecting plate and the application prospect of it were also introduced.
出处
《电子产品可靠性与环境试验》
2004年第1期20-23,共4页
Electronic Product Reliability and Environmental Testing
关键词
双波透射技术
超声波检测
无损检测
反射板
薄芯片
the double through-transmission technique
ultrasonic inspection
nondestruction inspection
reflecting plate
the thin chip
