摘要
比较分析四种微加工工艺的基本特征和技术难点,简述准分子激光与Nd∶YAG激光微制造技术的特点和应用范围。结合华中科技大学准分子激光微制造工作站的建设及其在微钻孔、微切割等方面的实际应用,分析准分子激光在MEMS(微机电系统)键合、焊接、封装过程中应用的可能性。
A comparison was given of properties of four micro-machining processes. Excimer laser and Nd∶YAG laser based micro-machining were described. An excimer laser based micro-machining workstation in Huazhong University of Science and Technology was installed, which was used in micro-drilling and micro-cutting.. The workstation will be modified for cutting, die bonding, wire bonding, welding, and post-packaging in MEMS.
出处
《激光与光电子学进展》
CSCD
2004年第2期47-53,共7页
Laser & Optoelectronics Progress
基金
863计划资助
项目编号为:2002AA421190
