摘要
研究了玻璃微球表面镀银过程中还原剂对镀层结合紧密程度、产品导电性的影响,并对银镀层的性能进行了测试。结果表明,用葡萄糖和酒石酸钾钠混合作还原剂改进了镀层的均匀度和结合强度。镀银玻璃微球有望用作高导电性聚合材料的导电填料。
Effects of different reducing agents on the compactibility of plating layer and conductivity of products were discussed in electroless Ag plating for glass microsphere. The properties of Ag deposit were also determined. The results show that both the uniformity and adhesion of Ag deposit were improved using compound of glucose and potassium tartrate as reducing agent. Ag electroless deposited glass microsphere can be possibly used as conductive filler of high conductive polymer materials.
出处
《电镀与涂饰》
CAS
CSCD
2004年第1期7-9,共3页
Electroplating & Finishing
基金
北京市自然科学基金资助项目(2032002)
关键词
化学镀银
玻璃微球
导电填料
electroless silver plating
glass microsphere
conductive filler
