摘要
研究了反应磁控溅射的动力学过程。理论分析与试验结果表明:反应气体流量随其压力的变化呈滞后效应,最佳镀膜工艺位于滞后区域。给出了金属靶阴极表面溅射清洗效果的伏安特性评价法,为克服"靶中毒"提供了有效的技术途径。
The kinetic process of reactive magnetron sputtering has been studied. Theoretical analysis and experimental results have showed that the mutual relationships between flow rates and partial pressures of reactive gases exhibiting hysteresis effect, and optimum plating technics locate in its hysteresis region.The evaluating method of sputtering cleanout effect on metal target surface by volt-ampere characteristic of target cathode has been given,which provides effective approach to eliminate 'target poisoning'.
出处
《真空与低温》
2003年第4期191-194,共4页
Vacuum and Cryogenics