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一种新型无卤阻燃覆铜箔板基板材料的制备 被引量:9

Studies on a novel non-halogen flame-retarding copper clad laminate
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摘要 以苯并嗪树脂与含磷环氧树脂作基体,外加磷酸酯类阻燃剂,KH平纹玻璃布作增强材料,制备了一种新型无卤阻燃覆铜板,其玻璃化转变温度为160℃,加强耐热性PCT(2p 水蒸气处理2h后,经288℃浸锡)试验达到385秒,径向弯曲强度为630 6MPa,阻燃性达到UL94V0级。 A novel non-halogen flame retarding copper clad laminate was prepared with benzoxazine,phosphate,epoxy and glass cloth.It was proved that the copper clad laminate had excellent thermal stability as well as flame resistance.The copper clad laminate has Tg of 160℃,and flame retardancy reaches US standard of UL 94 V-0.By Pressure Cooking Test(it was dealt under 2 atm water vapor bath for 2 hours,then dipping in 288℃ tin bath and the heat-resistant time was tested),the heat-resistant time(288℃)of the copper clad laminate was 385 seconds.Its Flexure strength was 630.6 MPa.
出处 《化学研究与应用》 CAS CSCD 北大核心 2004年第1期55-57,共3页 Chemical Research and Application
关键词 无卤阻燃 覆铜箔板 基板材料 制备 苯并噁嗪树脂 含磷环氧树脂 copper clad laminate non-halogen flame retarding benzoxazine epoxy
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