电子器件引脚失效分析

The Failture Analysis of the Electronic Chip Pin

本文针对电子器件引脚可焊接性极差的失效现象,利用显微设备、电子探针等设备进行了分析。探索材料晶体形态与器件性能的关系及其形成机理。寻求提高器件质量的依据。

This lecture analyzes something about vaplves base fin weldability very poor failure phenomena and utilization Met-allmikroskop , electron - probe etc. plantanalyse . Disquisition material crystal structure and kit attribute correeelate and form - theory . And approach a way of improve the mass of chip.