摘要
利用激光红外印制电路板焊点质量检测系统进行的一系列焊接工艺试验,结果证明该系统是一种对焊点作快速无损自动检测和工艺研究的有用工具。
In this paper, a series of solder joint experiments carried out with a laser infraredsolder joint inspect system is introduced. The results demonstrate that the set is an useful toolfor rapid-automatic nondestructive test and technological study on printed circuit boards.
出处
《应用激光》
CSCD
北大核心
1992年第1期10-12,共3页
Applied Laser
关键词
激光
红外
印制电路板
焊点
laser
infrared
welding point
printed circuit board
