摘要
介绍了印刷电路板用热固阻焊油墨LTR - 1研制的试验情况、技术指标 ,对连结树脂 (热固性树脂 )的制备工艺条件进行优化 ,根据试验确定了连结树脂、稀释剂、固化剂、着色剂、填充料、增稠剂、消泡剂。
The experiment and technical index of a LTR-1 type thermosetting solder resist ink for Printed Circuit Board were introduced, including the optimizing of the process conditions for link-resin manufacture. Based on the experimentation, the optimal proportion of link-resin, thinner, curing agent, colorant, filling agent, thickening agent, antifoaming agent and flow aid agent was determined.
出处
《辽宁化工》
CAS
2004年第2期76-79,共4页
Liaoning Chemical Industry
