乙炔端基砜(ATS)基半互穿聚合物网络(SIPN)体系的研究——热稳定性与降解动力学

Semi-Interpenetrating Polymeric Networks from acetylene-Terminated Sulfone and Thermoplastic resins——Thermal stabilities and Kinetics of Degration

用TGA研究了ATS、PEK-C、PES-C、PSF、PES及其共混物形成的SIPN的热稳定性和热降解动力学,并讨论了其降解机理。ATS固化物的热稳定性、降解活化能E和频率因子A与固化条件有关。热稳定性、E和A从高到低顺序为热塑性树脂(TP)>共混物>ATS。酚酞基与异丙撑基都为热稳定性较差的基团。

The thermal stabilities and kinetics of degradation for acetylene-terminated sulfone(ATS)、phenolphthatein polyaryl etherketone (PEK-C), phenolphthalein polyarylethersulfone(PES-C),bisphenol A polysulfone(PSF)、polyethersulfone(PES)and their blends were studied by thermogravimetry analysis(TGA).The mechanism of thermal degradafion have been discussed.The thermal stabilitly,energy of activation(E)and(preexponential factor(A)for cured ATS depend upon cure conditions.The orders of thermal stability A and E are thermoplastic resin(TP)>ATS/TP blend>cured ATS.