期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

有限元方法对SCSP粘结剂溢出问题的研究 被引量：6

Investigation of Adhesive Fillet Height in SCSP by Finite Element Methods
下载PDF
导出
摘要 利用有限元分析方法对 SCSP器件内部粘结剂的溢出问题进行了研究 .对粘结剂不同溢出高度的模型进行有限元建模分析 ,模拟结果能很好地和实验结果相吻合 .为了有效减少由热应力引发产生的分层 ,模拟得到了粘结剂溢出高度的最佳控制范围 . Finite element methods is used to analyze the adhesive fillet height in SCSP.The finite element simulation is performed according to different adhesive fillet height.The simulation results are in accordances with the experiment results.In order to reduce the delamination caused by thermal stress during assembly,the optimal adhesive fillet height range is obtained by finite element simulation.
作者 金玮 桑文斌 张奇 滕建勇
机构地区 上海大学材料科学与工程学院
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2004年第2期232-236,共5页 半导体学报（英文版）
关键词 SCSP 溢出高度 分层 有限元方法 SCSP fillet height delamination finite element methods (FEM)
分类号 TN405 [电子电信—微电子学与固体电子学]
  • 相关文献

参考文献9

  • 1[1]Anjoh I,Nishimura A,Eguchi S.Advanced IC packaging for the future applications.IEEE Trans Electron Devices,1998,45(3):743
  • 2[2]Sidharth,Valluri V,Gannammani R,et al.Characterization of a novel fine-pitch ball grid array package for flash memory application.Proceedings - Electronic Components and Technology Conference,2000:353
  • 3[3]Garrou P.Wafer level chip scale Packaging (WL-CSP)-an overview.IEEE Transactions on Advanced Packaging,2000,23(2):198
  • 4[5]Pitarresi J M,Sethuraman S,Nandagopal B,et al.Reliability modeling of chip scale packages.Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium,2000:60
  • 5[6]Moore T D,Jarvis J L.Failure analysis and stress simulation in small multichip BGAs.IEEE Transactions on Advanced Packaging,2001,24(2):216
  • 6[7]John S,Lidia L,Hsu S,et al.Fracture properties of molding compound materials for IC plastic packaging.Microelectronics and Reliability,1996,36(3):442
  • 7[10]LeGall C A.Thermal mechanical stress analysis of flip chip package.Masters thesis.School of Mechanical Engineering,Geogia Institute of Technology,Atlanta,GA,1996
  • 8[11]Schubert A,Dudek R,Michel B,et al.Materials mechanics and mechanical reliability of flip chip assemblies on organic substrates,Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes,Properties and Interfaces,1997:106
  • 9[12]Chen L,Zhang Q,Wang G,et al.The effects of underfill and its material models on thermo mechanical behaviors of a flip chip package.IEEE Transaction on Advanced Packaging,2001,24(1):17

同被引文献34

引证文献6

二级引证文献31

Journal of Semiconductors
2004年 第2期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部