摘要
对SMT和微电子封装技术中有关专业术语及其演变作了探讨,从中可以看出这两种技术不断提高及相互的促进作用。
Probe some specialized terms and the development of SMT and micro-electronics packaging.The continuous progress and mutual promotion of SMT and micro-electronics packaging can be found.
出处
《电子工艺技术》
2004年第2期89-91,共3页
Electronics Process Technology
关键词
SMT
安装
封装
焊区
引脚
凸点
SMT
Amount
Packaging
Soldering pad
Lead
Bump