期刊文献+

塑料芯片的红外激光加热键合研究 被引量:2

Investigation of Infrared Laser Heating and Bonding of Plastics Chips
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摘要 阐述了利用红外激光与物质相互作用的热效应实现微系统器件的局部加热键合原理。研究了红外激光键合塑料芯片的实施条件和键合工艺过程 ,建立了半导体激光键合实验装置 ,并实现了有机玻璃芯片的激光键合。 Plastics-based microsystem devices are now greatly investigated due to their low cost, biocompatibility and good processibility compared with silicon and/or glass based devices. Compared with their fabrication techniques, the bonding and packaging is a challenging issue for performing lost cost products. Conventional bonding and packaging methods have aroused problems like high temperature, high voltage, vibration damage or adhesive pollution. In this paper a method for plastics chips bonding was introduced by using infrared laser local heating. The bonding system was a diode laser heating system and had a minimal beam diameter of 50 microns. Nature and colored PMMA sheets were tested to demonstrate the weldability. Experimental results showed that among the colored polymer materials, those coated with carbon black ink had the best weldability.
出处 《红外技术》 CSCD 北大核心 2004年第2期68-71,76,共5页 Infrared Technology
基金 国家 8 63计划资助项目 (编号 :2 0 0 2AA40 40 70 )
关键词 塑料芯片 红外加热 键合工艺 半导体 有机玻璃芯片 激光键合 infrared laser,bonding,plastics chips,local heating
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参考文献6

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二级参考文献6

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共引文献11

同被引文献47

  • 1杨道虹,徐晨,董典红,金文贤,阳启明,张剑铭,沈光地.激光熔融键合在新型室温红外探测器的应用[J].功能材料与器件学报,2004,10(2):236-238. 被引量:2
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  • 3张威,王春青.光纤固定软钎焊焊点的三维形态模拟[J].电子学报,2005,33(5):875-878. 被引量:1
  • 4王又良,崔瑛,王健超,李明,曲世浦.塑料的激光焊接工艺[J].应用激光,2006,26(2):93-96. 被引量:21
  • 5马子文,汤自荣,廖广兰,史铁林,聂磊.无压力辅助硅/玻璃激光局部键合[J].Journal of Semiconductors,2007,28(2):217-221. 被引量:6
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  • 8Elke Zakel,Lars Titerle,Thomas Oppert,Ronald G.Blankenhorn.Laser Solder Ball Jet System for Optoelectronics packages[EB/OL],www..pactech.de.2006-08-12.
  • 9Dewen Tian,Chunqing Wang,Yanhong Tian.Effect of Thermal Aging on Microstructure,Shear and Mechanical Shock Failures for Laser Solder Ball Bonding Jjoint[C].Shenzhen:Proceeding of the 6th Intemational Conference on Electronics Packaging Technology,2005,120-124.
  • 10Wei Liu,Chunqing Wang,Yanhong Tian.Comparison of AuSnx IMCs's Morphology,Distribution in Lead-free Solder Joints Fabricated by Laser and Hot Air Reflow Process[C].Shenzhen:Proceeding of the 6th Intemational Conference on Electronics Packaging Technology,2005,136-140.

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