纯铜双层辉光离子渗镀钛扩散钎焊

DIFFUSION BRAZING OF Cu/Cu WITH DOUBLE GLOW DISCHARGE TITANIZING

试验纯铜双层辉光离子渗镀钛扩散钎焊的新方法。试验结果表明,纯铜表面经离子轰击净化及活化后,钛易于沉积与扩散,且阴极表面溅射对钛的渗层有“稀释”作用。随着基材与沉积层互扩散的进行,有助于达到实现钎焊的过渡液相条件。当渗钛层厚度足够时。即可获得满意的焊接接头。双层辉光离子渗金属使得用高熔点金属作为扩散助剂进行钎焊成为可能。

A new diffusion brazing technique with double glow discharge titanizing was applied to Cu/Cu brazing. After the surface of pure Cu was cleaned and activated by ion bombarding, Ti was easy to deposit on and diffuse into pure Cu, and the cathode surface sputtering to the titanized coat of Cu had a dilution effect. As the mutual diffusion went on between Cu layer and Ti layer, a transitional liquid phase occurred which contributed to the brazing. The satisfactory joint could be obtained when the titanizing layer reached to the required thickness. The double glow discharge process made the brazing possible with high melting metal as the diffusion solder.