显微剪切干涉表面粗糙度轮廓测量

Surface roughness profile measurement using shearing microscope interference method

介绍一种显微剪切干涉仪 ,其基于剪切干涉是自干涉 ,因而具有相当的抗环境干扰和抗振动的特性 ,结合剪切干涉技术与显微干涉技术 ,实现制造环境下表面粗糙度精密测量。本文介绍了该显微剪切干涉仪的原理 ,给出了实验结果。

Combining the shearing interference technique to microscope interference technique, a shearing microscope interferometry is developed.Microscopy interference has been applied for precisa roughness measurement successfully. Self-interference characteristic of shearing interference technique makes it be reference-free and high anti-vibration ability. The combination between the two techniques in the interfermetry makes it suitable for roughness measurement with high accuracy in manufacturing environment. In the paper, the basic measurement principle, the shear generator and wave-front recovery algorithm corresponding to roughness profile are introduced. The basic experiment results are given, which prove the feasibility of the interferometry.