摘要
随着电子封装技术不断朝着微型化的发展,在检查倒装芯片封装和芯片规模封装中,声学微成像技术得到了极大的应用。利用扫描探测器把超声波用脉冲输入入倒装芯片或别的封装,超声波在封装中向下穿透,直至遇到两种不同材料之间的界面为止。
Because of the compact design of flip chips and CSPs in electronic packaging , acoustic microimaging has become extremely important for inspecting these packages .When ultrasound is pulsed into a flip chip or other packages by the scanning transducer ,it travels downward into the package until it encounters the interface between two dissimilar materials .
出处
《电子质量》
2004年第2期37-38,共2页
Electronics Quality
