摘要
本文阐述了埋盲孔多层印制板的制作工艺,并对关键工序的控制作了详细说明。
This article discussed the manufacturing technology of multilayer PCB with buried and blind hole, also explained the key process control in detail.
出处
《印制电路信息》
2004年第4期8-9,20,共3页
Printed Circuit Information
关键词
PCB
埋/盲孔印制板
高密度互连
盲孔
埋孔
HDI
PCB with buried and blind via high density interconnect(HDI) blind via buried via
