挠性印制板用环氧聚合物与聚丙烯酸脂共聚物——互穿网络挠性基材的研究

Research of Epoxy Resin Polymer (ERP) and Acrylic Resin Polymer (ARP)——Interconnected Structure Flexible Copper Clad Laminates (ISFCCL) for FPC

本文采用了环氧聚合物与聚丙烯酸脂共聚物形成单体-预聚合-聚合物-单连互穿-互穿网络-进行研究来解决膨胀系数小、尺寸稳定、耐热性高、柔软非常好挠性印制电路基材。

This article conducts the research on expansion, dimension stability, thermal resist of flexible printed circuit laminates using epoxy resin polymer and Acrylic Resin Polymer to form simple substance. Pre-polymerization-polymer-single connection-interconnected structure.