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聚合物基复合材料模压成型过程固化度与非稳态温度场的数值模拟 被引量:10

NUMERICAL SIMULATION OF CURING DEGREE AND UNSTABLE TEMPERATURE FIELD DURING MODELING PROCESS OF POLYMER COMPOSITE MATERIALS
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摘要  聚合物基复合材料模压成型过程固化度与温度的动态变化为强耦合关系。本文作者根据固化动力学和传热学理论,建立了非稳态温度场与固化动力学数学模型。通过DSC实验分析确定模型中固化动力学参数。利用有限单元与有限差分相结合的方法,建立了温度场和固化度数值模型。应用Euler逐步迭代法实现解耦。对聚合物基复合材料模压成型过程固化度与非稳态温度场动态变化进行计算机数值模拟,与试验测定结果吻合。为优化模压成型工艺提供理论依据。 The relation between dynamic changes of curing degree and temperature is intensively coupled during the modeling process of polymer composite materials. On the basis of curing kinetics and thermal conduction theories, a mathematical model about temperature distribution and curing degree variation is established in this paper. Kinetics parameters based on the model are determined by using differential scanning calorimetry (DSC). A numerical model about temperature and curing degree is developed by combining the two-dimensional finite element with finite difference, and the coupled question is solved by using the Euler step-by-step iterative method. The computer code is worked out according to the established model to simulate the distribution of temperature and the curing degree, which are close to the test results, providing the theoretical basis for optimizing practical process parameters.
出处 《复合材料学报》 EI CAS CSCD 北大核心 2003年第5期73-76,共4页 Acta Materiae Compositae Sinica
基金 黑龙江省自然科学基金资助项目2002.E01-10
关键词 聚合物基复合材料 模压工艺 固化度 非稳态温度场 数值模拟 Computer simulation Curing Forming Polymers
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参考文献1

  • 1章熙民 任泽霈 梅飞鸣.传热学[M].北京:中国建筑工业出版社,1997.9-13.

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