摘要
本文采用套接方式进行了氧化铜无机胶粘接聚晶金刚石的试验研究.结果表明:这种粘接方式是可行的,压剪强度大于15MPa.
The experiment introduced in this paper is to bond polycrystaiiine diamond with copper oxide inorganic adhesive. The test results show that the sleeve bonding method is available and the shear strength is higher than 45MPa.
出处
《中国胶粘剂》
CAS
1992年第5期33-35,共3页
China Adhesives
关键词
无机粘合剂
粘接强度
聚晶金刚石
Inorganic adhesive
bonding strength
polycrystalline diamond.
