摘要
通过测定升温固化过程的DSC曲线,研究了硫脲及其衍生物对二氰二胺/环氧树脂潜伏固化体系的固化促进作用;测算了固化反应过程的表观活化能及反应级数。另外,通过贮存前,后的热焓及粘接剪切强度的变化考察了各体系的贮存稳定性.
According to the DSC curves of the heathing cure procedure, the article studies the accelerative action of thiourea and its derivatos to the latent curing systems of dicyandiamide/ epoxy resin, calculates the apparent activation energy and the reactive progression.In addition, the storage stability of each latent curing system is investigated by comparing △H value and adhesive shear strength before storage with those after storage.
出处
《中国胶粘剂》
CAS
1992年第5期26-29,共4页
China Adhesives
关键词
硫脲
衍生物
固化
稳定性
环氧树脂
Thiourea and its derivates
accelerative
action
latent curing system of epoxy resin
storage stability.
