摘要
介绍了芯片封装技术的发展演变与未来的芯片封装技术。从中可以看出芯片技术与封装技术相互促进、协调发展密不可分的关系。
The development of chip package technology is introduced in the paper, the furture of package technology is also included. At the same time, make out the close relation between IC chip and microelectronic package technology.
出处
《电子工业专用设备》
2004年第4期9-11,76,共4页
Equipment for Electronic Products Manufacturing
