全自动粘片机粘片位置精度提高之方案

Improve The Die Bond Position Precision

阐述了A型全自动粘片机粘片位置精度的制约因素以及改善方案。将MOUNTZ参数设定在250～260Pulse,真空破坏气压设定在0.03～0.04MPa,荷重弹簧调整在120g,能够较好的保证制品粘片位置精度。同时为了提高设备的适应能力,在理论分析的基础上对设备进行了改善,增加了防止引线框架带起装置并采用硬化吸头。

Uses the method of theoretically analysis and practical validating, Expatiates the restrict factors and improve projects for the die bond position precision of A mode full auto die bond equipment. To set ' MOUNT Z 'parameter in the range between 250 Pulse and 260 Pulse, Set the value of vacuum breakage in the range between 0.03～0.04MPa,And adjust the elasticity of shock absorption spring at 120g. In this condition, The die bond position precision can be pledged very well. At the same time, for the sake of improving the adapt capacity of the equipment, On the basis of theoretically analysis, We ameliorate some parts of equipment .For example, Add the function that prevent lead frame to be took up, Use the rubber tip which be designed by sclerotic process. Practice proves that the melioration of equipment and technics can have an evident effect on the die bond position precision.