卫星用半导体器件失效模式和机理分布

DISTRIBUTION OF FAILURE MODE AND MECHANISM FOR SATELLITE—BORNE SEMICONDUCTOR DEVICES

以中国空间技术研究院电子元器件可靠性中心1987～1990四个年度数百份失效分析报告为依据,得到卫星用半导体器件解剖前失效模式分布:逻辑失控占36.3%,开路占22.2%等;失效机理分布:铝腐蚀占1 6.3%,使用不当占14.6%等。该项研究以第一手数据首次全面、系统指出卫星用器件失效模式和机理。为卫星可靠性设计、优选器件厂及器件厂采取措施提供重要依据。

Based on a few hundreds failure analysis reports completedwithin the period of 1987 to 1990 by Electronic Components ReliabilityCenter,CAST,MAS,a number of distribution patterns of pre—dissectionfailure modes and failure mechanisms for satellite—borne semiconductordevices have been obtained. The relevant percentages for failure modes are:logic out of control 36.3%,open circuit 22.2%,ect. The relevant percenta-ges for failure mechanisms are:aluminium corrosion 16.3%,mi(?)use 14.6%,ect.For the first time this work points out entirely and systematically thefailure modes and failure mechanisms for satellite—borne devices,wherebyprovides important basis for taking measures in satellite reliability designand optimally selecting devices and manufacturers.