二甲基亚砜溶剂中化学镀铋的研究

Electroless Bismuth Plating in Dimethylsulfoxide

为了克服传统的电化学沉积铋使镀液不稳定,镀层受析氢影响的缺点,研究了一种新的以二甲亚砜为溶剂的化学镀铋体系,提出了两种可以沉积出银白光亮致密铋镀层的配方。探讨了不同基体上化学沉积铋的情况,结果以在铁片和铜片上沉积效果好,可作为代铬镀层应用。初步用电化学方法探讨了化学镀的机理,即先由铜提供电子,而后铋自催化使镀层增厚。用EDAX分析镀层确认只含铋,用XRD对镀层进行表征,证明了镀层中的铋以金属晶体存在,平均粒径为38nm。

Electroless bismuth plating technology in dimethylsulfoxide was investigated to overcome the disadvantages such as unstable bath and hydrogen evolution in traditional electrodepositing process, and two formulas that could obtain compact bismuth deposit with silver brightness were presented. Aside electroless bismuth depositing on different substrate was discussed. Experimental results indicate that the depositing effects on Fe and Cu substrates are so good that can use as substitute of chromium plating. Electrochemical tests indicate that the process of electroless bismuth plating is Cu supplies electron first and then deposit grows by self-catalysis of Bi. Only Bi exists in the deposit by EDAX, and is metal crystal with average size 38 nm by XRD.