化学镀镍磷合金表面涂覆SiO_2溶胶-凝胶封孔技术研究

Research on Pore Sealing of Electroless Ni-P Plating Alloy Covered with SiO_2 Sol-Gel

非晶态化学镀镍磷合金具有良好的耐酸、碱、硫化氢、液氨等介质的腐蚀,在工业上得到广泛应用。但由于Ni-P化学镀层属阴极涂层,一旦出现显微孔隙等缺陷,基体将加剧腐蚀。这给实际应用带来了复杂性和一定限制。文中采用溶胶凝胶方法进行封闭镀层针孔的研究,结果表明在镀层表面涂覆溶胶凝胶可以封闭针孔大幅度提高镀层的抗腐蚀能力。

Amorphous electroless nickel-phosphorus plating alloy is one of the most widely used industrial coatings owing to its excellent mean corrosion resistance in acid, alkali, H_2S, liquid ammonia. However, as a cathodical anticorrosion plating, the corrosion of metal substrate will worsen if there are pores in the plating, which brings complexity and restriction on its application. The nanoscopic SiO_2 Sol-Gel was used to seal porosity in electroless plating. The results showed that the anticorrosion of electroless plating was improved dramatically after the plating was covered with SiO_2 Sol-Gel film.