2Chou S Y, Krauss P R, Renstrom P J. Imprint of sub-25 nm vias and trenches in polymers[J]. Appl Phys Lett, 1995, 67 (21) : 3114-3116.
3Chou S Y, Krauss P R, Guo L J. Sub-10nm imprint lithograthy and application[J]. J Vac Sci Technol B, 1997, 15(6):2897-2904.
4Lee M J, Lee N Y. Anti-adhesive surface treatments of diverse self-assembled monolayers in nanoimprint lithography [J]. Adv Mater, 2006, 18: 3115-3119.
5Lindner E, Arias E. Surface free characteristics of polyfluorinated silane films[J]. Langmuir, 1992, 8:1195-1198.
6Zhang W, Chou S Y. Fabrication of 60nm transistors on 4-inches wafer using nanoimprint at all lithography levels[J]. Appl Phys Lett, 2003, 83(8): 1632-1634.
7Beck M, Graczyk M, Maximov I, et al. Improving stamps for 10 nm level wafer scale nanoimprint lithography [J]. Micro-electron Eng, 2002, 61: 441-448.
8Jenker. Process for preparing fluoroalkyl-containg organosilicon compounds and their use [P]. US: 5869728, 1999.
9Owens D K, Wendt R C. Estimation of the surface free energy of polymers[J]. J Appl Polym Sci, 1969, 13: 1741- 1747.
10Jeong H J, Kim D K, Lee S B. Preparation of water-repellent glass by sol-gel process using perfluoroalkylsilane and tetraethoxysilane[J]. J Colloid Interface Sci, 2001, 235 : 130- 134.
