插层聚合制备环氧树脂/蒙脱土灌封材料的研究

Study on Epoxy/Montmorillonite Encapsulating Materials Obtained from Intercalation Polymerization

采用阳离子交换的方法对蒙脱土进行了有机化处理 ,使蒙脱土由亲水性变成亲油性 ,并且使其层间距由原来的 1 2nm扩大到 2 2nm。采用X射线衍射仪研究了有机蒙脱土在环氧树脂中的剥离行为 ,制备了环氧树脂 /蒙脱土灌封材料并测试了其性能。试验结果表明 ,环氧树脂与有机蒙脱土的相容性好 ,蒙脱土在环氧树脂中完全剥离 ;环氧树脂 /蒙脱土灌封材料的电学性能、力学性能、热性能以及吸水率与纯环氧树脂固化物相比均有不同程度的提高和改善。

Organophilic montmorillonite was obtained by cation exchange on clay surface,which was modified from hydrophilic to hydrophobic and led to the increase in distance between silicate layers about 1nm.The encapsulating materials of epoxy resin/montmorillonite were prepared ,and the exfoliation behavior of epoxy resin in the organomontmorillonite has been investigated by XRD . It is found that the affinity between the organomontmorillonite and epoxy resin was very good and complete exfoliation of montmorillonite was achieved with MeTHPA as curing agent and BDMA as catalyst .Properties test results show that electricity properties ,mechmical properties,heat distortion temperature were all improved by addition of the organomontmorillonite in the encapsulating materials, and the encapsulating materials containing montmorillonite had lower linear thermal expansion coefficiency and water absorption compared with neat epoxy resin.