摘要
混合封装电力电子集成模块(IPEM)是目前中功率范围内电力电子集成的主要方式。IGBT器件与控制和驱动电路高密度地封装在一起,IGBT的发热对驱动保护电路会产生非常不利的影响,我们针对这个问题进行了研究。利用三维有限元法建立了模块内的传热模型,对不同发热功率下IGBT的结温以及驱动保护电路PCB的最高温度进行了计算和分析。另外,对功率电路与驱动保护电路PCB之间存在空气隙以及模块完全被密封后模块内的传热问题也进行了实验研究。
The research on the integrated power electronic module (IPEM) based on hybrid packaging technology at the medium power rate has been paid much attention to recently. When assembled with power chips very compact, the drive/ protection circuits will be seriously affected by the heat from power chips. This problem has been studied. A 3D Finite Element model of a wire-bonding IPEM is presented to analyze the thermal behavior and temperature rise inside the module . Specially, the temperature rise of the drive/protection circuits is evaluated and the experimental verification is given. When the module is encapsulated by silicon gel, but an air gap is sandwiched between power chips and drive/protection circuits, the thermal transfer problem of this module is studied experimentally.
出处
《电子器件》
CAS
2004年第1期19-23,共5页
Chinese Journal of Electron Devices
基金
国家自然科学基金"电子系统集成理论与若干关健技术的研究"(项目批准号:503237030)
关键词
电力电子集成模块
传热
3D有限元模型
Integrated Power Electronic module, heat transfer, 3D Finite Element model
