电子元器件高密度组装中所用高分子材料及技术

Macromolecule Materials and Technology Used in Electronics High Density Packaging

电子设备行业为了实现小型、轻量化与高速、大容量的信息传输,对电子元器件及装置实施小型化、高密度组装、微细导线、最短连线所需的三维组装和立体电路成形技术。论述了电子元器件组装中所采用的高分子材料及对其高性能的期望、金属与高分子材料的连接所应用的界面控制技术。讨论了界面控制技术的具体应用,如多层线路板、半导体密封材料、异向性导电连接材料、半导体制造工程用粘结带等。

Make a brief introduction of electric equipment industry's new technology for information transfer from small size and light weight to high speed and capacity, and tridimensional assembly and electrocircuit technology for electric component and instrument's need of miniaturization, high density, micro wire and the shortest wire splice. Dissertate macromolecular material and expect for its performance, and interface control technology of metal and macromolecular material connect. Also refer to interface control technology application such as multi-layers board, multi-conductor package material, the different tropism electric conduction material, adhesives tape for multi-conductor manufacture and so on.