碳纳米管的化学镀铜

Electroless plating of carbon nanotube with copper

碳纳米管因其优异的力学、物理性能,是一种理想的复合材料增强体,但其与基体金属的润湿性较差。通过化学镀在碳纳米管表面镀上一层连续的铜镀层,以改善碳纳米管与金属基体的润湿性,增强界面结合力。通过TEM观察表明:由于碳纳米管长径比大,反应活性低,表面曲率大,直径细和镀层薄(50～100nm),使碳纳米管很难得到完整的镀层。通过对镀前处理工艺(氧化、敏化、活化)的优化以增加活化点,对传统镀液配方的调整使镀速尽可能低,成功地在碳纳米管上镀覆一层铜,为碳纳米管复合材料制备打下了良好的基础。

Carbon nanotube is a promising reinforcing material for its unique mechanical and physical properties, though wetting property of metal-matrix and carbon nanotube is poor. Interfacial strength would be increased between carbon nanotubes and metal-matrix through electroless plating a continuous layer of copper on carbon nanotubes. TEM images show that it is difficult to gain continuous elcetroless plating layer for carbon nanotubes because of large proportion of longitudinal axis length and its diameter, weak reaction capacity, large curvature of surface, small diameter and thin plating layer(50～100 nm. A series of way of optimization(oxidization, sensitization and activation were used to add activated sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath can decelerate electroless plating. The surface of carbon nanotubes was successful coated with continuous layer of copper.