添加剂作用下钯电沉积行为研究

Studies on the Electrodeposition Behaviors of Palladium by the Actions of Additive

在含有4g·L-1Pd(NH3)2Cl2和104g·L-1NH4H2PO4的闪镀钯基础电解液中,采用极化曲线、循环伏安法和计时安培法研究添加剂作用下钯在玻璃碳电极上的电沉积和电结晶行为.结果表明,添加剂阻化钯的电沉积;钯在玻碳电极上的交换电流密度很低;钯电沉积过程经历了晶核形成过程,其电结晶机理在不含添加剂时接近于三维连续成核,含添加剂时接近于三维瞬时成核.

The basic electrolyte solution of flash palladium plating contains of 4 g (.) L-1 Pd (NH3)(2)Cl-2 and 104 g (.) L-1 NH4H2PO4. In the solution with or without additive the electrodeposition and electrocrystallization behaviors of palladium on glassy carbon(GC) electrode were studied by means of polarization curve, cyclic voltammetry and potentiostatic current transient. The results showed that the additive hindered the electrodeposition of palladium. The exchange current density of palladium on GC electrode was very low. The electrodeposition of palladium proceeded a nucleation. Its electrocrystallization mechanism in the electrolyte solution without additive was in tendency to nucleate progressively in three dimensions while in the electrolyte solution containing additive it was in tendency to nucleate instantaneously in three dimensions.