摘要
本文对铸型石膏作了一系列试验研究。用扫描电镜观察了不同焙烧温度下试样断口显微结构的变化过程;探索了焙烧温度对石膏抗弯强度、线收缩率的影响;揭示了显微结构与性能之间的内在联系。
In this paper, the authors study systematically the influence of baking temperature on flexural strength and linear shrinkage of samples. With SEM, authors observe the change of microstructure of samples which are baked under different temperature. The relation between the microstructure and strength is delineated.
出处
《铸造技术》
CAS
北大核心
1992年第5期42-44,共3页
Foundry Technology
