添加Fe对CuCr触头材料显微组织的影响

Effect of Added Fe Element on Microstructure of CuCr Contact Materials

采用机械合金化制粉、爆炸压实制坯、低温烧结成形制备了CuCr以及添加第三组元的CuCrFe触头材料,借助金相、扫描电镜和透射电镜等分析CuCr合金以及CuCrFe合金的显微组织,重点研究添加Fe对CuCr触头材料爆炸态和烧结态显微组织的影响。结果表明,添加Fe对CuCr机械合金化粉、CuCr合金爆炸态和烧结态的显微组织影响较大,即显著细化CuCr合金的显微组织;Fe主要固溶于Cr相中;添加Fe后CuCr合金的应变条纹和位错不仅没有消失,反而出现位错缠结的花纹,因而使CuCr合金的电导率进一步降低。

CuCr and CuCrFe contact materials were made by mechanically alloying, explosive compaction and sintering at low temperature. OM, SEM and TEM were used to observe their microstructure. It was studied mainly that the effect of the added Fe element on microstructure of CuCr contact materials. The results show that the effect of the added Fe is more obvious and microstructure of the CuCrFe alloys is much finer than that of CuCr alloys; a majority of Fe dissolves into Cr phase, and the added Fe does not make strain strips and dislocation vanish, on the contrary, it makes riffled dislocation appear so that conductivity of CuCr alloys is much lower.