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FT-IR用于液晶环氧树脂固化动力学的研究 被引量:3

CURING KINETICS OF LIQUID-CRYSTALLINE EPOXY RESINS BY USING FT-IR
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摘要 用FT-IR研究了液晶环氧-4,4′-二缩水甘油醚基二苯基酰氧(PHBHQ)与4,4′-二氨基二苯甲烷(DDM)固化反应的动力学,研究表明,PHBHQ与DDM的固化反应按自催化反应机理进行,固化过程=66.51kJ/mol,lnA1=中产生的羟基可进一步加速反应,计算出分步反应的动力学参数分别为Ea1=69.05kJ/mol,lnA2=7.34。6.65。 The curing mechanism and kinetics of liquid crystalline epoxy resin--4-epoxypropoxy phenyl-4′-epoxypropxy benzoate (PHBHQ) with DDM were studied by using Flourier Transmit Infrared (FT-IR). The curing reaction proceeded in auto-accelerate reacting mechanism and is accelerated by the hydroxyl group produced in the system. The kinetics parameters of each step of curing reaction were calculated: E_(a1)=(66.51) kJ/mol, ln A_1=(6.65), E_(a2)=( 69.05) kJ/mol, ln A_2=(7.34).
出处 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2004年第3期168-170,174,共4页 Polymer Materials Science & Engineering
关键词 液晶环氧树脂 自催化反应 4 4'-二缩水甘油醚基二苯基酰氧 PHBHQ 环氧值 liquid crystalline epoxy resin curing auto-accelerate reacting mechanism
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  • 1Carfagna C. Liquid Crystalline Polymers, WLCP 93,Capri, Italy, June 1-4, 1993.
  • 2Barclay G G, Penczek P, et al. J. Polym. Sci. : Part A: Polym. Chem. , 1998, 36: 21-29.
  • 3Carfagna C, Amendola E, Glamberini M, et al. Polyrn.Eng. and Sci.. 1995, 35(2): 137.
  • 4Lee J Y, Jang J. Polym. Bull. , 1997, 38: 447-454.
  • 5Mormann W, Kuckerta C. Macromol. Chem. Phys.,1998, 199: 845-851.
  • 6Mormann W, Markus Brocher. Macromol. Chem.Phys, 1997, 198: 3615-3626.

同被引文献35

  • 1唐旭东,贺征华,王艳,陈晓婷.含磷化合物DOPO-HQ的合成与表征[J].合成技术及应用,2005,20(2):19-21. 被引量:7
  • 2王超,王博,曲彪,苏韬.聚硫醚改性环氧树脂室温固化耐高温结构胶粘剂[J].中国胶粘剂,2007,16(1):1-5. 被引量:16
  • 3Cai H Y,Li P,Sui G,et al.Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC[J].Thermochim.Acta,2008,473:101-105.
  • 4Choi E J,Seo J C,Bae H K,et al.Synthesis and curing of new aromatic azomethine epoxies with alkoxy side groups[J].Eur.Polym.J.,2004,40:256-265.
  • 5Kissinger H E.Reaction kinetics in differential thermal analysis[J].Anal.Chem.,1957,29(11):1702-1706.
  • 6Crane L W.Analysis of curing kinetics in polymer composites[J].Polym.Sci.,1973,11:533.
  • 7Wang C S,Shieh J Y.Phosphorus-containing epoxy resin for an electronic application[J].Applied Polym Sci,1999,73(3):353-361.
  • 8Liu W Y,Hsiue G H,Chiu Y S,et al.Phosphorus-containing epoxy for flame retardant.I:Synthesis,thermal,and flame-retardant properties[J].Applied Polym Sci,1996,61:613-621.
  • 9Liu W Y,Hsiue G H,Lee R H,et al.Phosphorus-containing epoxy for flame retardant.III:Using phosphorylated diamines as curing agents[J].Applied Polym Sci,1997,63:895-901.
  • 10Rwei S P,Liu AY,Liou KC,et al.Curing and Pyrolysis of Cresol Novolac Epoxy resin Containing[2-(6-oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol][J].Polymer Engineering and Scince,2004,44(2):376-387.

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