喷射成形CuCr25合金触头材料的制备及致密化处理

Preparation and Densification of CuCr25 Contact Materials by Spray Forming Process

利用喷射成形技术制备了CuCr2 5合金触头材料 ,研究了雾化压力对显微组织、致密度和收得率的影响 ,对制得的沉积坯件进行了热锻压和热等静压致密化处理 ,并测试了触头材料的密度、硬度和电导率。研究结果表明 :最合适的雾化压力为 0 .6MPa ,沉积坯件经过 95 0℃锻压后再在 10 70℃ ,2 0 0MPa下热等静压 8h ,可以得到全致密的触头材料 ,铬颗粒平均直径小于 10 μm ,硬度达 10 0HB ,电导率 2 5～2 9Ms·m- 1 ,说明致密化处理后的喷射成形CuCr2 5合金是一种优良的触头材料。

CuCr25 alloy contact materials are prepared by spray forming technology. The study of the influence of the atomization pressure on microstructures, density and yield of the preforms shows that the suitable atomization pressure is 0.6 MPa, and the preforms become almost compact contact materials after hot-forging at 950 ℃, then HIP at 1070 ℃+200 MPa for 8 h. The mean diameter of Cr grain is less than 10 μm, hardness more than 100 HBS, and electrical conductivity is 25～29 Ms·m -1. So CuCr25 alloy made from spray forming after densification after appropriate densification is a kind of excellent contact materials.