摘要
本文介绍以硅为衬底的微细加工技术的发展前景与展望。随着特征尺寸的不断缩小 ,微细加工技术的水平逐渐提高。当特征尺寸进入到微米、亚微米量级时 ,需要克服“极限”束缚 ,增加器件的集成度。
This article introduce the development foreground and view of micron processing technology basing on silicon. Along with the characteristic size continuously reducing the micron processing technology's level gradually increase. When the characteristic size reach micron、submicron degree, overcoming the“limit”binding in order to increase the integration of device.
出处
《微处理机》
2004年第3期1-2,7,共3页
Microprocessors
关键词
MOS场效应晶体管
特征尺寸
介质
MOS field effect transistor
Characteristic size
Medium
