高厚径比、高可靠性背板的孔加工与金属化
Hole Preparation & Metallization of High Aspect Ratio, High Reliability Back Panels
摘要
本文探讨印制板生产厂商在形成高层数大规格背板时将面临一些什么样的技术挑战。
A discussion of what technology challenges face the fabricator in creating high-layer count, large format back panels.
出处
《印制电路信息》
2004年第5期38-44,共7页
Printed Circuit Information
参考文献8
-
1Printed Circuits Handbook, Clyde F.Coombs, Jr., editor.McGraw-Hill, 4th edition
-
2Carano, Michael et al., The Reliability of PTH Printed Wiring Board Manafactured With a Graphity-based Direct Metalization process. CircuiTree, March, 1999
-
3Internal Communication with William Birch,PWB Interconmect solutions
-
4Young, Todd, Carano, Michael and Polakovic, Frank.Thermal Reliability of High Density Enterconnects. Presented at IPC Printel Circuits EXPO, 1999
-
5Electrodeposition: Theory and Practice,"" The Electrochemical Society Inc.,1987
-
6Kessler and Alldre, Plating and Surface Fnfishing, September, 1976
-
7Dutch Reverse Pulse plating-product technical literature.
-
8Electrochemicals Inc-Field Application Data
-
1李钖峰,横内宏宇.印刷电路板微孔加工精度的评价[J].机械工艺师,1993(8):4-6. 被引量：1
-
2朱明勇.印制板加工浅析[J].电子工艺简讯,1989(3):6-7.
-
3何易.高效率微小孔加工技术[J].工具展望,2003(4):6-7.
-
4荒井邦夫.印制线路板加工设备的动向[J].印制电路信息,2004(7):72-72.
-
5龚永林.新产品新技术(104)[J].印制电路信息,2016,24(2):71-71. 被引量：1
-
6朱晨.微孔质量改善[J].印制电路信息,2009,0(S1):152-160.
-
7杨春秀,李俊荣,李木森.印刷线路板小孔冲模[J].机械工艺师,1991(11):33-34.
-
8马让奎.印刷线路板小孔冲模的研制[J].宝成技术,1993(2):16-22.
-
9崔荣,蒋忠明.多层印制电路板凹蚀工艺的实现[J].印制电路信息,2013,21(S1):143-149. 被引量：2
-
10翁毅志.PCB多层厚板的去钻污工艺[J].印制电路信息,2004,12(2):37-39.
