关于微带电路金属镀层的探讨

Study on Plating of the Microstrip-circuit

通过对聚四氟乙烯基铜制微带电路几种不同金属镀层的测试研究,探讨了铜制微带电路表在节金、代金的镀覆途径,达到了节金、代金的目的。

The essay presents the test study of some different kinds of plating of polyfluortetraethylene copper-microstrip-circuit and experiments on the methods of plating of the surface of copper-microstrip-circuit by using less gold or replacing gold. And the goal has been achieved.