摘要
本文用平面的透射电子显微术(TEM)、剖面的透射电子显微术(XTEM)以及卢瑟福背散射和沟道谱(RBS),研究InSb中离于注入Zn^+,Mg^+,Be^+产生的二次缺陷。以及它们的退火特性。结果表明,轻离子Be^+注入产生的二次缺陷比重离子Zn^+注入产生的要少得多,而Mg^+离子介于Be^+离子和Zn^+离子之间,在中等剂量下(1×10^(13)cm^(-2)附近),注入损伤并不严重,而且容易恢复。从360℃到440℃之间作了退火温度的研究。从研究结果发现,退火温度以360℃为佳。离子注入InSb中的二次缺陷的形貌与Si中的不同,InSb中的二次缺陷以位错网为主,位错环所占比例不大且尺寸较小,而沉淀物和层错四面体也出现在其中。
In this paper, the secondary defects and their annealing behaviours in Zn+, Mg+, Be+ ion-implanted InSb have been investigated by means of the plan-view transmission electron microscopy (TEM), cross-sectional TEM(XTEM) and Rutherford backscattering and channeling spectroscopy. The result shows that the secondary defects caused by the lighter Be+ ion implantation are much less than that caused by the heavier Zn+ ion implantation. And the ion Mg+, in the region of medium dose (about 1×1031/cm2), causes the damage easy to restore. The effect of annealing temperature is investigated from 360℃ to 440℃, and the result indicates that the 360℃ is a better annealing temperature. The figuration of secondary defects in ion-implanted InSb is differant from that in ion-implanted Si: the secondary defects in ion-implanted InSb consist of dislocations and dislocation networks mainly, and the dislocation loop is not dominant, however, precipitates and fault tetrahedras also exist in it.
出处
《物理学报》
SCIE
EI
CAS
CSCD
北大核心
1992年第5期809-813,T001,T002,共7页
Acta Physica Sinica
基金
国家自然科学基金