摘要
通过对两种具有代表性的无铅软钎料断口的分析,介绍了Sn-Zn-Bi-X(Ag,Cu)系钎料合金的断裂韧性的初步研究结果,发现Bi固溶于钎料基体导致了钎料合金脆性的增加,随着Bi含量的增加,脆性随之增大。同时发现,钎料的冷却方式对钎料的脆性倾向有较大的影响。
By the study of fractures of two representative lead-free solders, the rupture tenacity of Sn-Zn-Bi-X(Ag,Cu) solder system was primarily researched and the result was introduced. It was found that the integration between the solder matrix and bismuth increased the brittleness of the solder alloys. Along with the addition amount of bismuth, the brittleness of the solder alloys would be enhanced. In addition, it was found that the cooling mode affect the brittleness tendency of the solder greatly.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第6期48-50,共3页
Electronic Components And Materials
