倒装焊芯片封装中的非接触检测技术

An Overview of Non destructive Inspection in Flip Chip Packaging

介绍了倒装焊芯片生产工艺及其质量控制中所需检测的项目,并分类综述了其中所涉及的光学检测、X射线检测、声学检测等几种非接触检测方法的基本原理和步骤,这些方法对于微纳米制造中微结构性能测试和缺陷检测具有同样重要的意义。

For improving process control and quality assurance capabilities of flip chip packaging, inspection is required.This paper simply introduces the things of the Flip chip's concept,the process of flip chip packaging and the inspection requirements.Non destructive inspection techniques including optical,X ray and acoustic inspection will be discussed.