塑料微流控芯片热压成形温度控制装置

The Development of Temperature Control System for Fabrication of Plastic Microfludic Chips with Hot embossing Method

采用聚合物如塑料等制作微流控芯片是拓展芯片应用,实现芯片产业化的关键。温度是塑料微流控芯片热压成形过程中的重要工艺参数。本文采用半导体热电致冷堆,设计了适合塑料芯片制作的温度控制装置;分析了升降温过程中所需的加热/制冷功率,并对升降温特性进行了研究;设计了半导体热电致冷堆供电电源装置。对温度控制装置的升/降温及温度控制精度进行了实验,并给出了实验结果。

Using plastic in fabrication microfludic chips and realizing automating is the key to extend the applications.Temperature is one of the important parameters in hot embossing.An temperature control system for fabrication of plastic chips which is based on thermoelectric module for heating and cooling was designed;the power of heating/cooling in hot embossing and the necessity of circulation water for assistant cooling were analyzed;aiming at the characteristic of thermoelectric module,a convenient for industry computer control power supply device was developed.The experiment of speed of temperature rasing/falling and accuracy of control are carried out.The results show that the temperaturecontrol system is feasible for fabrication of plastic microfludic chips with hot embossing.