期刊文献+

扭转臂杠杆式MEMS膜开关的分析 被引量:1

Analysis for MEMS membrane switch using torsion spring and leverage
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摘要 为解决现有的MEMS微波开关的激励电压太高、微连接和膜开关的击穿电压等问题,提出了一种独特结构的MEMS微波开关—扭转臂杠杆式膜开关,并对其进行了理论分析,用conventorware和ADS(ad vanceddesignsystem)软件进行了仿真。由于利用了膜结构以及扭转臂和杠杆的原理,这种独特的MEMS微波开关激励电压比较低、隔离度较高、插入损耗比较低、稳定性好。 To solve the problems of the high actuation voltage,joint of microstructure and puncture voltage of current MEMS microwave switches,a MEMS microwave switch with unique structure is proposed—MEMS membrane switch using torsion spring and leverage.It has been theoretically analyzed and simulated by using conventor ware and ADS(advanced design system).As utilizing principle of torsion spring and leverage,the unique MEMS microwave switch has low actuation voltage,high isolation,low insertion loss and good stability.
出处 《传感器技术》 CSCD 北大核心 2004年第7期71-73,共3页 Journal of Transducer Technology
关键词 MEMS膜 隔离度 插入损耗 共面波导 MEMS membrane isolation insertion loss coplanar waveguide
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参考文献6

  • 1Dooyoung Hah,Euisk Yoon,Songcheol Hong.A low-voltage actuated micromachined switch using torsing spring and leverage [J].IEEE Transactions on Microwave Theory and Techniques,2000,(48):2540-2545.
  • 2Jamie Z,Chen S,Eshelman S,et al.Chuck goldsmith micromachined low-loss microwave switches [J].IEEE Journal of Microelectromechanical System,1999,(8):129-134.
  • 3Qian J Y,Flaviis F De,Li G P.Finite Element Model of Microelectrmechanical Systems Switch Operating at Microwave Frequencies [C].Irvine California:Department of Eletrical and Computer Engineering University of California,1998.
  • 4龙永福,赖宗声,朱自强.高电容比射频/微波MEMS膜开关的理论分析和数值模拟[J].微波学报,2003,19(1):56-60. 被引量:4
  • 5杨恒,鲍敏杭,沈绍群,李昕欣,任建军.静电力作用下微机械结构的位移特性分析[J].复旦学报(自然科学版),1999,38(3):282-288. 被引量:5
  • 6章吉良 杨春生.微机电系统及其相关技术[M].上海:上海交通大学出版社,2001.45-52.

二级参考文献7

  • 1[1]Yao J J,Chang M F. A surface micromachined miniature switch for telecommunications applications with signal frequencies from DC up to 4 GHz. In:int Conf Solid-State Sensors and Actuators. Dig, Stockholm, sweden, June 1995:384~387.
  • 2[2]Goldsmith C, Randall J, et al. Characteristics of micromachined switches at microwave frequencies. In: IEEE MTT-S int Microwave Symp Dig, San Francisco, CA. June 1996: 1141~1144.
  • 3[3]Park J Y, Geun H K, et al. Monolithically integrated micromachined RF MEMS Capacitive switches. Sensors and Actuators A., 2001, 89(5): 88~94.
  • 4[4]Muldavin J B, Rebeiz G M. High-Isolation MEMS shunt switches-Part 2: Design. IEEE Trans Microwave Theory Tech. 2000, 48(6): 1053~1056.
  • 5[5]Muldavin J B, Rebeiz G M.High-Isolation MEMSshunt switches-Part 1: Modeling. IEEE Trans Microwave Theory Tech. 2000, 48(6): 1045~1052.
  • 6[6]Osterberg P, Yie H, et al. Self-consistent simulation and modeling of electrostatically deformed diaphragms. Proc IEEE MEMS Conf., Jan,1994:28~32.
  • 7任建军,陶盛,沈绍群.静电键合力引起硅微结构畸变的研究[J].仪表技术与传感器,1997(1):17-20. 被引量:4

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同被引文献6

  • 1曾耿华,唐高弟.微波多芯片组件中键合线的参数提取和优化[J].信息与电子工程,2007,5(1):40-43. 被引量:14
  • 2[5]Simon W,Kulke R,Wien M,et al.Interconnects and Transitions in Multilayer LTCC Multichip Modules for 24GHz ISM-Band Applications[C]// 2000 IEEE MTT-S International Microwave Symposium Digest,2000:1047-1050.
  • 3[6]Brown R L,Polinski P W,Shaikh A S,et al.Manufacturing of microwave Modules Using Low-Temperature Cofired Ceramics[C]// 1994 IEEE MTT-S International Microwave Symposium Digest,1994:1727-1730.
  • 4[7]Blood W,Feng Ling Myers T,Petras M.Library Development Process for Embedded Capacitors in LTCC[C]// 2000 IEEE Conference on Electrical Performance of Electronic Packaging,2000:147-150.
  • 5[8]Eurskens W,Wersing W,Gohike S,et al.Design and Performance of UHF Band Inductors,Capacitors and Resonators Using LTCC Technology for Mobile Communication Systems[C]// 1998 IEEE MTT-S International Microwave Symposium Digest,1998:1285-1288.
  • 6赵全明,滕建辅,周国飞,李锵.低温共烧陶瓷技术及发展[J].河北工业大学学报,2002,31(5):85-89. 被引量:14

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