SAW器件晶片在线探测中的边缘效应

The Edge Effect of SAW Wafer in Probe On-line Testing

在声表面波器件的探测中,对于某些膜厚较厚,线条陡直度较好的品种,由于声信号在相邻芯片间指条的反射作用,使得其在不同位置的芯片探测结果出现差异,影响了对合格与否的判断,称为边缘效应。该文就这种边缘效应进行讨论和实验,提出用分离反射信号的方法进行修正,同时对该修正方法对测试结果的影响进行了讨论。

In process of probe test of SAW devices, due to the acoustic signal reflection of fingers between adjacent die, test results differ from each other according to its position on the wafer. We called this edge effect, which is discussed and modified with separate reflect signal method in this paper. The effect of this method on the testing result is also given.