化学镀Cn/Ni—P双层电磁屏蔽镀层的研究

Study on Bilayer Electroless Plating of Cu/Ni-P for Electromagnetic Shielding

介绍在ABS塑料上获得Cu/Ni-P双层镀层的化学镀工艺,并对镀层的屏蔽性能进行了测试。实验结果表明,Cu/Ni-P双层镀层具有优良的屏蔽效果,这种化学镀工艺有希望取代常规的电弧凌涂锌、含镍粉漆等工艺方法。

This paper introduces the electroless plating process which obtains bilayer Cu/Ni-P platings on ABS plastics and determines the shielding performance of the platings. Results show that the bilayer platings have excellent shielding effects and this process is promissing in replatings have excellent shielding effects and this process is promissing in replacing some ordinary method such as are spraying zinc and nickel powder containing paint.