摘要
以硫酸盐为基础溶液,选择酒石酸钾钠作为络合剂,讨论了镀液中Cu/Zn比、络合剂加入量、镀液碱度和电流密度对镀层成分的影响。在此基础上确定了沉积70Cu30Zn镀层的基本配方及工艺参数,还研究了有机添加剂WZ-1对沉积黄铜的良好作用,并确定了其最佳的加入量。
In this work, using sulphate as main salt and KNa-tartrate as complex agent ,the effects of Cu/Zn ratio, complex agent concentration,pH of bath and current density on composition of electrodeposited coating were investigated. The basic composition of the bath and technological parameters for electrodeposition of 70Cu 30Zn alloy have been determined. It was shown that the WZ-1 organic additive has a favourable effects on the plating.
出处
《材料保护》
CAS
CSCD
北大核心
1993年第3期14-17,共4页
Materials Protection
