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系统芯片的软硬件协同设计技术 被引量:4

Hardware/Software Co-design Technology of SoC
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摘要 IC设计已经进入SoC时代。传统的设计手段已经无法满足需要 ,软件和硬件的结合越来越紧密。介绍了软硬件协同设计技术的基本概念和设计流程 。 IC design technology has entered SoC era. Traditional design methods have not done well in it completely. The relationship of hardware and software is more and more close. The basic concepts and design flow of hardware/software co-design have been introduced in this paper. The estimation and prospect of this technology has been also provided.
机构地区 华中科技大学
出处 《舰船电子工程》 2004年第3期11-15,共5页 Ship Electronic Engineering
关键词 SOC 软硬件协同设计 IP SoC hardware/software co-design IP
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参考文献13

  • 1[1]Vladimir A. Zivkovic. Testability in Hardware/Sof-tware Codesign Systems[DB/OL]. Http:∥tdt.el.utwente.nl/output/2001
  • 2程宇.复杂系统芯片的开发[J].电子产品世界,2001,8(17):70-71. 被引量:1
  • 3[3]Joseph Borel. Design automation in MEDEA: Present and future[J]. IEEE Micro,1999,19(5):71-79
  • 4[4]Johann Notbauer, Thomas Albrecht, Georg Niedrist et al. Verification and management of a multimillion- gate embedded core design[C]. In: DAC'99. New Orleans, L A,1999. 425-428
  • 5[5]Gajski D D, Wu A C H, Chaiyakul V el al. Essential issues for IP reuse. Proceedings of the ASP-DAC Design Automation Conference[C]. Asia and South Pacific, 2000, 37-42
  • 6郑赟,黄国勇.通过遗传算法进行系统级软硬件划分[J].计算机辅助设计与图形学学报,2002,14(8):731-734. 被引量:12
  • 7[8]http://www.vsi.org/library/specs
  • 8[10]http://www.synopsys.com
  • 9[11]Kunle Oluotun, Mark Heinrich, David Ofelt. Digital system simulation: Methodologies and examples[C]. In: DAC'98. San Francisco, California, 1998,658-663
  • 10[12]P. Coste, F. Hessel el. Multilanguage Design of Heterogeneous Systems[C]. IEEE Hardware/Software Co-Design

二级参考文献1

  • 1Petru Eles,Zebo Peng,Krzysztof Kuchcinski,Alexa Doboli. System Level Hardware/Software Partitioning Based on Simulated Annealing and Tabu Search[J] 1997,Design Automation for Embedded Systems(1):5~32

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