摘要
研究了杜美丝的特性和电镀工艺参数及其相互关系,结果表明:玻璃与杜美丝之间良好的气密性封接决定于杜美丝中铁镍合金芯线与外覆铜层间的交界面结合程度及铜层的微观结构与化学成份。
The corelations between characteristics of Dumet wire and electroplating parameters were investigated. The results showed that the sealing properties were related to the cohesion in Fe-Ni/Cu interface and the microstructure of copper.
出处
《材料保护》
CAS
CSCD
北大核心
1993年第11期18-19,共2页
Materials Protection
