聚醚酮酮(PEKK)/4,4′-二苯氧基二苯砜(DPODPS)多嵌段共聚物的合成与性能

Synthesis and Properties of Polyether ketone ketone/4,4′- Diphenoxydiphenylsulfone Multiblock Copolymers

采用溶液缩聚法由酰氯端基聚醚酮酮 (PEKK)齐聚物和 4 ,4′ 二苯氧基二苯砜 (DPODPS)制备了PEKK/DPODPS多嵌段共聚物 ,用DSC、TGA等方法对共聚物进行了表征和性能测试。结果表明 ,随着共聚物中DPODPS含量的增加 ,共聚物的熔融温度逐渐降低 ,而其玻璃化转变温度则逐渐升高。当DPODPS质量分数在 32 6 3%～ 4 0 73%范围内时 ,所得共聚物的Tg为 185～ 193℃ ,比纯PEKK的Tg 高出 2 0～ 2 8℃ ;其Tm为 32 2～ 346℃ ,比纯PEKK的Tm 降低 35～ 5 9℃ ,这既保持了纯PEKK的耐热性 ,又改善了熔融加工性能。该组成范围内的共聚物的拉伸强度 (σt)为 86 6～ 84 2MPa ,拉伸模量 (M)为 3 1～ 3 4GPa ,断裂伸长率(ε)为 18 5 %～ 2 0 3%。

A series of multiblock copolymers composed of polyether ketone ketone(PEKK) and 4,4′-diphenoxydiphenylsulfone(DPODPS) were synthesized by polycondensation of acyl chloride-terminated PEKK oligomers and 4,4′-diphenoxydiphenylsulfone. The properties of the copolymers were characterized by DSC and TGA. The results indicated that the T g of the copolymers increases with increase in DPODPS content and the T m of the copolymers decreases with increase in DPODPS content. When the ω(DPODPS) of the copolymers ranged from 32.63% to 40.73%, the T g of the copolymers were in range from 185 ℃ to 193 ℃, 20～28 ℃ higher than that of para-linked pure PEKK and the T m of the copolymers were from 322 ℃ to 346 ℃, 35～59 ℃ lower than that of para-linked pure PEKK. The copolymers showed both good thermal property and melting-processing property. The tensile strengths of the copolymers containing 32.63%～40.73% DPODPS are 86.6～84.2 MPa, the tensile modulus 3.1～3.4 GPa and the breaking elongation 18.5%～20.3%.